China Propyne Sulfonic Acid Manufacturer, Supplier, Factory

To create much more benefit for shoppers is our enterprise philosophy; client growing is our working chase for Propyne Sulfonic Acid,PS Sodium Propynesulfonate,Sodium Propynesulfonate,Propargyl sulfonate,Propynesulfonicacidsodiumsalt, We sincerely welcome mates from all over the globe to cooperate with us to the basis of long-term mutual added benefits.
Propyne Sulfonic Acid, We attained ISO9001 which provides solid foundation for our further development. Persisting in "High quality, Prompt Delivery, Competitive Price", now we have established long-term cooperation with clients from both overseas and domestically and get new and old clients' high comments. It is our great honor to meet your demands. We have been sincerely expecting your attention.

Hot Products

  • PS Sodium Propynesulfonate

    PS Sodium Propynesulfonate

    CAS No.: 55947-46-1
    PS Sodium Propynesulfonate can improve the brightness of current density zone, enhance positioning force, leveling ability and impurity tolerance.
  • 2,2-Bipyridine

    2,2-Bipyridine

    CAS No.: 366-18-7
    2,2-Bispyridine 2,2-Bipyridine is a kind of organic synthetic and medicine intermediate
  • TCA Chloral Hydrate

    TCA Chloral Hydrate

    CAS No.: 302-17-0
    TCA Chloral Hydrate can be used as hypnotics and anticonvulsants for insomnia, restlessness and convulsions.
  • MOME Aqueous Cationic Polymer

    MOME Aqueous Cationic Polymer

    CAS No.: 10882-76-0
    MOME Aqueous Cationic Polymer is used in cyanide, alkaline, cyanide-free zinc plating.
  • TC-DEP N,N-Diethyl-2-propyneammonium Sulfate

    TC-DEP N,N-Diethyl-2-propyneammonium Sulfate

    CAS No.: 84779-61-3
    TC-DEP N,N-Diethyl-2-propyneammonium Sulfate is leveling agent, brightening agent.
  • Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent

    Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent

    CAS No.: 27206-35-5
    Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent can be used in combination with typical copper plating formulations such as nonionic surfactants, polyamines and other hydrogen sulfide compounds.

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