China Perfluoromethanesulfonic anhydride Manufacturer, Supplier, Factory

We usually believe that one's character decides products' high quality, the details decides products' excellent ,with the REALISTIC,EFFICIENT AND INNOVATIVE staff spirit for Perfluoromethanesulfonic anhydride,Trifluoromethanesulfonic Anhydride,trifluoromethanesulfonic Anhydride,CAS 358-23-6,Triflic anhydride solution, Welcome to speak to us should you be intrigued inside our solution, we're going to provide you with a surprice for Qulity and Price tag.
Perfluoromethanesulfonic anhydride, we sincerely hope to establish a good and long-term business relationship with your esteemed company through this opportunity, based on equality, mutual benefit and win-win business from now to the future. "Your satisfaction is our happiness".

Hot Products

  • 2-mercaptobenzimidazole-M

    2-mercaptobenzimidazole-M

    2-mercaptobenzimidazole-M can improve working current density. It is often combined with N,SPS.
  • 2,2-Bipyridine

    2,2-Bipyridine

    CAS No.: 366-18-7
    2,2-Bispyridine 2,2-Bipyridine is a kind of organic synthetic and medicine intermediate
  • TC-DEP N,N-Diethyl-2-propyneammonium Sulfate

    TC-DEP N,N-Diethyl-2-propyneammonium Sulfate

    CAS No.: 84779-61-3
    TC-DEP N,N-Diethyl-2-propyneammonium Sulfate is leveling agent, brightening agent.
  • EHS Sodium Isethionate

    EHS Sodium Isethionate

    CAS No.: 1562-00-1
    The EHS Sodium Isethionate is used to improve the ductility of the coating and the plating force of the bath.
  • UPS 3-S-Isothiuronium Propyl Sulfonate

    UPS 3-S-Isothiuronium Propyl Sulfonate

    CAS No.: 21668-81-5
    UPS 3-S-Isothiuronium Propyl Sulfonate can also be used in other acidic plating bath, other precious metals such as acidic silver plating and palladium plating.
  • Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent

    Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent

    CAS No.: 27206-35-5
    Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent can be used in combination with typical copper plating formulations such as nonionic surfactants, polyamines and other hydrogen sulfide compounds.

Send Inquiry