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Hot Products

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    BMP Butynediol Propoxylate

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    BMP Butynediol Propoxylate is a condensate of butynediol and propylene oxide, and is one of the most commonly used long-term nickel plating intermediates.
  • Perfluoro n-butylsulfonylfluoride

    Perfluoro n-butylsulfonylfluoride

    Perfluoro n-butylsulfonylfluoride The structural properties of Perfluoro n-butylsulfonylfluoride are similar to those of perfluorooctane sulfonyl fluoride.
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    MPS Sodium 3-mercaptopropanesulphonate

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    MPS Sodium 3-mercaptopropanesulphonate is used to prepare brightener for copper plating, especially for the plating of printed circuit boards.
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    HBOPS-Na Butynediol Sulfopropyl Ether Sodium

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    HBOPS-Na Butynediol Sulfopropyl Ether Sodium is often used in combination with saccharin, PPS and PPSOH wetting agent.
  • EHS Sodium Isethionate

    EHS Sodium Isethionate

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    The EHS Sodium Isethionate is used to improve the ductility of the coating and the plating force of the bath.
  • Perfluoro n-butylsulfonic Acid

    Perfluoro n-butylsulfonic Acid

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    The structure of the Perfluoro n-butylsulfonic Acid is similar to that of perfluorooctyl sulfonic acid.

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