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Hot Products

  • 2-mercapto Thiazoline H1

    2-mercapto Thiazoline H1

    2-mercapto Thiazoline H1 is used as main component of additive for acid copper plating.Good brightness and level result can be obtained.
  • 2,2-Bispyridine

    2,2-Bispyridine

    2,2-Bispyridine is a kind of organic synthetic and medicine intermediate
  • HBOPS-Na Butynediol Sulfopropyl Ether Sodium

    HBOPS-Na Butynediol Sulfopropyl Ether Sodium

    CAS No.: 102-60-3
    HBOPS-Na Butynediol Sulfopropyl Ether Sodium is often used in combination with saccharin, PPS and PPSOH wetting agent.
  • ALS Sodium Allylsulfonate

    ALS Sodium Allylsulfonate

    ALS Sodium Allylsulfonate is used as brightener for nickel plating to improve metal distribution and ductility.
  • Ammonium Perfluorobutanesulfonate

    Ammonium Perfluorobutanesulfonate

    Ammonium Perfluorobutanesulfonate is a perfluorinated anionic surfactant and can be used as a wetting agent, leveling agent and cleaning agent for coatings.
  • Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent

    Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent

    CAS No.: 27206-35-5
    Bis(3-sodiosulfopropyl) Persulfide Copper foil leveling agent can be used in combination with typical copper plating formulations such as nonionic surfactants, polyamines and other hydrogen sulfide compounds.

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