CAS No.: 15990-43-9
DPS N,N-Dimethyldithiocarbamic Acid (3-sulfopropyl) Ester, Sodium Salt can be used for electroless plating of precious metals or as plating stabilizer.
CAS No.: 102-60-3
EDTP N,N,N'N'-tetra(2-hydropropyl)ethylene Diamine is soluble in water easily, and the aqueous solution showes alkaline.
2-mercapto Thiazoline H1 is used as main component of additive for acid copper plating.Good brightness and level result can be obtained.
CAS No.: 17636-10-1
MPS Sodium 3-mercaptopropanesulphonate is used to prepare brightener for copper plating, especially for the plating of printed circuit boards.
CAS No.: 21668-81-5
UPS 3-S-Isothiuronium Propyl Sulfonate can also be used in other acidic plating bath, other precious metals such as acidic silver plating and palladium plating.
Ethylenethiourea N is a brightener for copper plating, excellent results can be obtained by adding a very small amount of the brightener.
